Media
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The ECSEL book of projects 2
Rob van Schaijk et al.
“CMUT: a low cost versatile ultrasonic platform”
MUT2019, 11-12 June 2019
K. Nanbakhsh, et al.
“Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants”
in Proc. 41st Int. Conf. of the IEEE Engineering in Medicine and Biology (EMBC) 2019, Berlin, Germany, Jul. 2019
Maria Virumbrales-Muñoz et al.
“Force spectroscopy-based simultaneous topographical and mechanical characterization to study polymer-to-polymer interactions in coated alginate microspheres”
Scientific Reports, Nature Research, (2019) 9:20112
Omer Can Akgun et al.
“A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants”
in Proc. IEEE Biomed. Circ. Syst. Conf. (BioCAS) 2019, Nara, Japan, Oct.2019
O. C. Akgun, et al.
“A chip integrity monitor for evaluating long-term encapsulation performance within active flexible implants”
in Proc. IEEE Biomed. Circ. Syst. Conf. (BioCAS) 2019, Nara, Japan, Oct. 2019
I. Lucarini, et al.
“Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers Integrated on Ultra-thin and Flexible Substrates”
IEEE International Ultrasonics Symposium (IUS), Glasgow, United Kingdom, 2019
M. Benido, et al.
“Injection Locked Oscillators with Current Reuse”
2019 IEEE International Symposium on Circuits and Systems (ISCAS), Sapporo, Japan, 2019
G. Rodrigues, et al.
“A Small-Footprint Quasi-Passive 1st Order ΣΔ Modulator”
2019 IEEE International Symposium on Circuits and Systems (ISCAS), Sapporo, Japan, 2019
Chemseddine Zebiri
“A Compact Semi-Circular and Arc-Shaped Slot Antenna for Heterogeneous RF Front-Ends”
Electronics, vol. 8 issue 10, October 2019
C. Mountain, et al.
“Novel method of alignment to buried cavities in cavity-SOI wafers for advanced MEMS devices”
Micro and Nano Engineering, vol. 5 December 2019
Issa Elfergani, et al.
“Low-Profile and Closely Spaced Four-Element MIMO Antenna for Wireless Body Area Networks”
Electronics, vol. 9 issue 2, January 2020
João Guerreiro et al.
“On the Achievable Capacity of MIMO-OFDM Systems in the CathLab Environment”
Sensors, vol. 20, issue 3, January 2020
Raed A. Abd-Alhameed, et al.
“Recent Technical Developments in Energy-Efficient 5G Mobile Cells: Present and Future”
Electronics, vol. 9 issue 4, April 2020
Kambiz Nanbakhsh et al.
“A Chip Integrity Monitor for Evaluating Moisture/Ion Ingress in mm-Sized Single-Chip Implants”
in IEEE Transactions on Biomedical Circuits and Systems, 07 July 2020
O. C. Akgun, et al.
“A chip integrity monitor for evaluating moisture/ion ingress in mm-sized single-chip implants”
IEEE Trans. Biomed. Circuits Syst.,vol. 14, no. 4, pp. 658-670, Aug. 2020
N. Bakhshaee Babaroud, et al.
“PDMS to Parylene Adhesion Improvement for Encapsulating an Implantable Device”
in Proc. 42nd Int. Conf. of the IEEE Engineering in Medicine and Biology (EMBC) 2020, Montreal, Canada, Jul. 2020
Glenn Ross et al.
“The impact of residual stress on resonating piezoelectric devices”
Materials&Design, vol. 196, 2020
Pieter Harpe TU/e
“Low Power SAR ADC techniques and applications”
overview lecture, IEEE ISCAS conference, October 10-21, 2020
Jian Li et al.
“Embedded High-Density Trench Capacitors for Smart Catheters”
ESTC2020
Kristina Bespalova et al.
“Temperature Stability of Electrode/AlScN Multilayer Systems for pMUT Process Integration”
in proc. IEEE International Ultrasonic Symposium, September 2020
I. Lucarini, et al
“Dielectric Characterization of Structural and Passivation Films for Flexible CMUT Microfabrication”
IEEE International Ultrasonics Symposium (IUS), Las Vegas, USA, 2020
La Mura
“Impact of the variability of microfabrication process parameters on CMUTs performance”
IEEE International Ultrasonics Symposium (IUS), Las Vegas, USA, 2020
Rabuske
“Polymath: A Platform for Rapid Application Development of Modular EDA Tools”
2020 IEEE International Symposium on Circuits and Systems (ISCAS), Sevilla, 2020
Rodrigues, et al.
“A Sub-μW 3–10MHz Stacked Oscillator with a Duty-Cycle Calibrated Level Shifter”
2020 IEEE International Symposium on Circuits and Systems (ISCAS), Sevilla, 2020
Nanbakhsh, Kambiz, et al.
“Long-term Encapsulation of Platinum Metallization Using a HfO2 ALD-PDMS Bilayer for Non-hermetic Active Implants”
2020 IEEE 70th Electronic Components and Technology Conference (ECTC). IEEE, 2020
Nanbakhsh, Kambiz, et al.
“Towards CMOS Bulk Sensing for In-Situ Evaluation of ALD Coatings for Millimeter Sized Implants”
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC). IEEE, 2020